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Hong Kong to Hold Tender for 1-Year RMB Government Bonds on July 24, 2025
The Hong Kong Monetary Authority (HKMA) has announced a tender for the issuance of 1-year RMB HKSAR Institutional Government Bonds. The tender is scheduled to take place on July 24, 2025, as part of the Infrastructure Bond Programme.
As per the announcement, the HKMA will be offering a total of RMB1.5 billion in bonds, which will mature on July 28, 2026. The interest rate for these bonds has been set at 1.48% per annum, with semi-annual interest payments.
It is worth noting that this tender is exclusively open to Primary Dealers appointed under the Infrastructure Bond Programme. Individuals interested in purchasing these bonds must apply through one of these Primary Dealers, and all applications must be made in amounts of RMB50,000 or integral multiples thereof.
The results of the tender are expected to be published on multiple platforms, including the HKMA’s website, the Hong Kong Government Bonds website, Bloomberg, and Refinitiv. The publication is anticipated to take place no later than 3:00 pm on the day of the tender.
In a statement, the HKMA emphasized that the proceeds from the bond issuance will be directed towards infrastructure projects, aligning with the Infrastructure Bond Framework outlined by the Hong Kong Government Bonds website.
The bonds in question are identified by the issue number 01GB2607001 and stock code 85038 (HKGB1.48 2607-R). Trading of these bonds is set to commence on the Stock Exchange of Hong Kong on July 29, 2025.
For more information regarding this tender and the bonds being issued, interested parties can refer to the Information Memorandum available on the Hong Kong Government Bonds website.
Source: Blockchain.News
